A new tool will accelerate defect detection in nanometer transistors, making the debugging of technology processes easier and more enjoyable

New way to see atomic defects in modern semiconductors

Scientists from Cornell University, together with ASM and TSMC, have created a method that allows visualization of hidden atomic imperfections in cutting‑edge chips. This approach is especially important for debugging the manufacturing processes of integrated circuits: the more accurately defects can be assessed, the lower the yield loss and the faster mature production is achieved.

What was studied

The work used processed wafers with Gate‑All‑Around (GAA) transistors – the latest type of gate that completely surrounds the channel. The Belgian research center Imec supplied the samples. Each GAA channel consists of a “tube” of 18 atoms across its cross‑section; its walls can have inhomogeneities, scratches and other defects that directly affect transistor characteristics. Although the structure cannot be altered after processing, researchers were able to track manufacturing quality at each step of thousands of production stages, aiming to reduce errors.

How they do it

To observe defects a few atoms wide, scientists used multislice electron ptychography. This is a method with sub‑angstrom, nanometer depth resolution that collects scattered electrons and reconstructs atomic‑scale images from them.

The key step is collecting four‑dimensional diffraction data via an EMPAD detector in a scanning transmission electron microscope (STEM). The data then undergo phase reconstruction and modeling of electron propagation through many “slices” of the material. Unlike traditional projection methods, ptychography reconstructs the full volumetric structure from a single set of measurements, allowing precise determination of individual atom positions, local lattice distortions, and phase‑boundary parameters.

What it gives

* Quantitative assessments of defect spectra – previously only accessible indirectly.
* Ability to quickly identify and eliminate technological problems early in development.
* Demonstrated interest from major players such as TSMC shows the practical value of the approach for debugging modern chip manufacturing.

Thus, the new method paves the way for more reliable and efficient quality control in high‑technology semiconductor production.