AMD and Samsung have strengthened their collaboration in the field of HBM4 memory for AI accelerators
AMD and Samsung Collaboration: A New Phase in AI Infrastructure Development
1. Lisa Su’s Visit Confirmed
AMD CEO Lisa Su was indeed traveling to South Korea for talks with Samsung Electronics representatives. Samsung’s official press release confirmed that both companies signed a new memorandum of understanding last week in Pyeongtaek, where Samsung’s large memory chip manufacturing complex is located.
2. Key Elements of the Agreement
* HBM4 for Instinct MI455X accelerators – Samsung will supply high‑performance HBM4 chips to AMD’s new graphics accelerators.
* DDR5 for EPYC and Helios – DDR5 memory will be used in EPYC server CPUs and the AMD Helios platform.
3. Samsung’s Advantages
Company officials emphasized their strong capabilities in chip packaging and contract manufacturing, enabling rapid response to market demands.
4. Lisa Su’s Words
“Creating a new generation of AI infrastructure requires deep collaboration across the industry,” she said.
“We are excited to expand our work with Samsung, combining their memory leadership with our Instinct GPU family, EPYC CPUs, and rack‑mount platforms. Integration from silicon to system is critical for accelerating AI innovations that impact the real world.”
5. Technical Details
* Samsung HBM4 – manufactured on a 10‑nm DRAM process and 4‑nm logic technology; transfer rate up to 13 Gb/s per contact, bandwidth 3.3 TB/s.
* HBM market – Samsung controls 22% of the HBM market, SK hynix 57%, according to Counterpoint Research.
6. Future Plans
* AMD will use HBM4 memory in Instinct MI455X accelerators and DRAM technology for sixth‑generation EPYC server processors (Venice).
* Samsung is ready to discuss contract manufacturing services for chip production, but details are not yet disclosed.
* DDR5 supplies will be optimized for the Helios architecture, and Samsung is already the primary supplier of HBM3E for Instinct MI350X and MI355X accelerators.
Thus, the AMD‑Samsung partnership aims to strengthen AI infrastructure through joint development and production of advanced memory types, enabling both companies to deploy innovations into real solutions more quickly.
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