ASML will expand its product line by adding high‑technology packaging devices for microchips to its lithography equipment.

ASML Expands Product Line Beyond EUV Lithography

ASML remains the sole manufacturer of extreme ultraviolet (EUV) lithographic equipment, which is critically important for producing the most advanced chips used in artificial intelligence. However, the company does not intend to stop at this achievement. It plans to significantly broaden its portfolio by adding assembly, packaging, and enclosure equipment for chips.

Packaging Equipment Development Plans

As part of new initiatives, ASML is beginning to develop tools that will allow chip manufacturers to create more complex multilayer structures. Such solutions are needed not only for current tasks but also for future generations of AI processors.

Chief Technology Officer Marco Peters emphasized: “We’re looking beyond the next five years — up to 10–15 years ahead. We’re exploring potential industry development directions and defining packaging, bonding, and related requirements.”

Management Changes

In October, the company promoted Peters to chief technology officer, replacing Martin van den Brink, who had led the technology division for almost 40 years. ASML also announced a reorganization of its technology business with an emphasis on engineering roles rather than managerial ones.

Investor Reaction

Investors have already factored confidence in ASML’s dominance in EUV lithography and high expectations for Peters and new CEO Christopher Fuke, appointed in 2024, into the stock price. The company’s shares, with a market capitalization of about $560 billion, rose more than 30 % over the year. The current price corresponds to roughly a 40‑times P/E ratio, whereas Nvidia shares trade at a 22‑times multiple.

Why Packaging Is Becoming More Profitable

Multilayer chip packaging allows developers to overcome size constraints and accelerate complex computations. As the complexity and precision required to create such structures increase, the previously unprofitable chip packaging business now generates significant profit.

New Tools for Large Chips

As AI chip sizes continue to grow, ASML is developing new scanning systems and lithography machines capable of producing even larger microchips. Last year, the company unveiled the XT:260 scanner, specifically designed for high‑performance memory and processors used in AI. According to Peters, engineers are already exploring the possibility of deploying additional equipment “right now” on production lines.