Broadcom announced the release of one million 3-D chips by 2027, challenging Nvidia's position

Broadcom announced significant progress in developing three‑dimensional (3‑D) chip packaging, aiming to become a serious competitor to Nvidia in the AI hardware market. The company plans to ship at least one million of these chips by 2027, which it estimates could generate several billion dollars in additional revenue.

How the technology works
The technology is based on vertically stacking two crystals into a single stack. This increases data transfer speed and reduces power consumption—critical parameters for data centers. Customers can choose different process nodes for each layer, tailoring the chip to a specific task.

Partners and customer base
Fujitsu became Broadcom’s first major partner, already producing engineering samples at TSMC’s 2‑nm and 5‑nm process nodes. The company also works with Google (TPU) and OpenAI, completing their architectural projects up to the production stage. This effort has led to a two‑fold revenue increase in the AI segment—$8.2 million in the first fiscal quarter.

Future plans
* By 2027 – release of 3‑D chips: two models will appear in the second half of this year, three by 2027.
* Experiments with more complex configurations – engineers are already testing combinations of eight pairs of crystals, indicating intentions to scale the technology.

Competitive position
Broadcom now directly competes with Nvidia and AMD, offering an alternative focused on high throughput and design flexibility. According to Vice President of Product Marketing Harish Bharadwaj, adoption of the technology among customers is accelerating, and the company views the current moment as a turning point for silicon engineering strategy.