Chinese chip manufacturers have approached the government to create a domestic alternative to ASML.

Chinese semiconductor leaders call for national coordination of EUV lithography development (2026–2030)

In an article published as part of a special issue, senior executives from China’s largest micro‑manufacturing companies presented a unified action plan. The goal is to synchronize efforts to develop lithographic systems and thereby increase the country’s technological independence.

Who spoke Brief content of the address
Zhao Jingzhong (Naura Technology Group) Called for pooling national resources to integrate breakthroughs achieved in different institutes.
Chen Nansyan (Yangtze Memory Technologies Corp.) Argued that a “Chinese ASML” must be created to overcome external supply barriers and increase self‑sufficiency.
Liu Weiping (Empyrean Technology) Emphasized the importance of allocating funds and human resources to build an integrated company.

Representatives of leading semiconductor industry institutes identified key weak points: design automation software, silicon wafer materials, and gas technologies.

Why it matters now
* U.S. export restrictions (since 2020) limit China’s access to sub‑7 nm technology, making EUV lithography critically important.
* ASML is the only world supplier of EUV lithography machines. The equipment consists of 100,000 components from 5,000 suppliers; ASML merely assembles them.
* Internal breakthroughs: China has made significant progress in specific areas (EUV lasers, silicon wafer fabrication, optical systems), but integrating these technologies remains a complex challenge.

Key work directions
1. Create a unified platform for research and development of advanced devices and components.
2. Develop software for electronic design automation.
3. Strengthen materials science: produce high‑quality silicon wafers and gases needed for EUV lithography.
4. Establish national coordination within the five‑year plan (15th Five‑Year Plan).

Assessment of the current situation
* China holds about 33 % of the global micro‑manufacturing market in mature process nodes (28 nm and above).
* In these segments, the country has significant potential both in design and production.

In conclusion, experts demand that the government urgently develop implementation plans for integrating all key EUV lithography components. This will enable China to create its own “ASML” and ensure independence in critically important micro‑manufacturing technologies.