Intel is developing infrastructure for building future Nvidia Feynman AI chips

Intel is considering participating in the packaging of future Nvidia AI chips

*Discussion period – GTC 2026 days*

1. Key events
- Discussion of Intel’s participation

During the GTC 2026 conference, the potential role of Intel in packaging Nvidia’s upcoming *Feynman* generation chips was actively discussed.

- Source of information

TrendForce, relying on Malaysian and Taiwanese sources, reports that Intel plans to use its facilities in Malaysia and EMIB technology to attract orders from Nvidia.

2. Cooperation with Malaysia
The initiative is being implemented by Prime Minister Datuk Seri Anwar (Datuk Seri Anwar), who acknowledged on social media that Intel’s head Lip‑Bu Tan, also connected to Malaysia, shared plans to expand the production complex.
Intel specializes in testing and packaging its own processors but will offer services to third‑party customers as it masters more advanced technologies.
Planned volume: part of new lines in Malaysia will be dedicated to chip packaging using cutting‑edge technology.

3. Technological solutions
EMIB and Foveros – Intel intends to deploy EMIB (Embedded Multi‑Die Interconnect Bridge) and Foveros in Malaysia.

- Partner Amkor has already mastered the first one.

Why is EMIB more advantageous?
Compared with traditional single‑substrate chip integration used by Nvidia, EMIB reduces costs without sacrificing product performance.

4. Technical details
Parameter | Current status | Planned growth by 2028
---|---|---
Substrate area | 120 × 120 mm (minimum 12 HBM stacks) | 120 × 180 mm, up to 24 HBM stacks
Memory type | HBM3 and below | Support for HBM4 via EMIB‑T technology

5. Potential prospects and risks
- Possible order from Nvidia

Intel’s technological capabilities position it to bid for packaging services for future Nvidia AI chips.

- Competitive threat

Intel’s plans to launch its own AI accelerators could deter a potential customer.

- Technical risks

The complexity of chip integration increases the likelihood of defects and raises service costs, which should also be considered in evaluating the partnership.