ASML announced the final preparation of High‑NA EUV for mass production of ultra-thin chips

ASML attracts chip manufacturers’ attention even to High‑NA technology

Chipmakers planning to produce chips without using high‑numerical‑aperture (High‑NA) scanners are already showing interest in ASML’s new lithography systems. The Dutch company assures that trials have shown the equipment is ready for mass production.

Key data from the technical director

ASML’s Technical Director Marco Peters told Reuters that the results of High‑NA EUV scanner tests allow the company to present them in San Jose at an upcoming technology conference. According to the test outcomes, using the latest scanners it was possible to process about 500 000 silicon wafers with a process node of less than 2 nm.

Readiness for serial production

Each of these scanners costs roughly $400 million, but ASML states that they are “formally” ready for mass production. The equipment delivers the required exposure precision and is down for no more than 20 % of the time due to setup and maintenance. This makes it suitable for serial production of advanced chips.

Client adaptation period

Nevertheless, customers will need another two–three years to fully integrate High‑NA EUV technologies into their manufacturing lines. Already now giants such as Intel, TSMC, and Samsung are studying this equipment.

By the end of the current year ASML plans to reduce downtime to 10 % and improve scanner efficiency metrics. The company is ready to share detailed data with customers to convince them of the feasibility of moving to the next generation of lithography.