Huawei has developed a method to produce 122 TB SSDs without using high‑technology flash memory

Huawei develops its own high‑density SSDs without access to Western chips

Since 2019, the Chinese giant Huawei Technologies has been under U.S. sanctions, limiting its ability to purchase the latest memory chips. As a result, the company had to find an alternative way to create high‑capacity solid‑state drives (SSDs) based on less dense but readily available Chinese memory.

How Huawei circumvents restrictions
* DoB method – “crystal on PCB”

According to Blocks&Files, cited by TrendForce, Huawei uses DoB technology to manufacture a 122 TB SSD. Unlike traditional 3D‑NAND manufacturers, where multiple memory layers are stacked inside the chip itself, DoB mounts NAND crystals directly onto the PCB. This increases storage density by about 33 %, although the exact number of layers in the stack is unknown.

* Possible drive sizes

Thanks to this packaging, Huawei can produce SSDs up to 245 TB – volumes comparable to foreign competitors, even without access to the latest memory chips.

Current and future models
| Capacity | Status |
|----------|--------|
| 61.44 TB | Already on sale (server solutions) |
| 122.88 TB | In stock |
| 245 TB | Planned for launch |

Problems and solutions
* Heat dissipation – denser packaging leads to higher temperatures.
* Signal quality degradation – direct mounting of crystals onto the board worsens data transmission quality.

To combat power consumption and signal loss, Huawei plans to use controllers equipped with artificial‑intelligence elements. These controllers will perform some computations “on‑the‑fly,” reducing the need to transfer large volumes of data outside the SSD and back again.

Thus, despite sanctions, Huawei is developing its own memory packaging technology that allows it to produce competitive SSDs with capacities up to 245 TB. This solution reduces dependence on Western suppliers and opens new opportunities for the server market.