TSMC plans to start a pilot production run of chips on the sub‑nanometer A10 process by 2029

Brief summary of news on TSMC's expansion plans

ItemWhat is reportedRevenue from 3‑nm processes in Q1 accounts for 25 % of the company’s total revenue, as noted by TSMC CEO C.C. Wei at the annual financial results briefing. New 3‑nm plants
• Taiwan – a new site in the Southern Science Park, mass production scheduled for the first half of 2027.
• United States (Arizona) – a second plant will also run 3‑nm processes, with a launch in the second half of 2027.
• Japan (Kumamoto) – a third site, production to start in 2028.

Re‑tooling existing equipment
In Taiwan, equipment for 5‑nm processes will be upgraded to 3‑nm.

Details on new and expandable sites
Southern Science Park (Taiwan) – New 3‑nm plant – mass production in the first half of 2027.
Arizona, USA – Second 3‑nm plant – launch in the second half of 2027.
Kumamoto, Japan – Third 3‑nm plant – planned for 2028.

Plans for more advanced process nodes (2 nm and below)
LocationPlantsTechnologyTimelineBaoshang, Taiwan (F20 complex)P1, P2 – 2 nm; P3 – 2 nm and A14Construction to finish mid‑2026.Gaoxun, Taiwan (F22 complex)P1, P2 – 2 nm; P3 – 2 nm/A16; P4 – 2 nm/A16Equipment for P3 starts in Q2 2026; P4 construction completes January 2027.Taina, Taiwan (A10 complex)P1–P4 – processes < 1 nmPilot production to start in 2029 at ~5,000 wafers/month.Arizona, USA (F21)P1 – 4 nm; P2 – 3 nm (equipment installation Q3 2026).Plans for 2 nm, A16 and A14 for P3–P5.
*A total of 11 plants are planned with capacities ranging from 20,000 to 25,000 wafers per month.*

New facilities: cases and packaging
FacilityTechnologyTimelineFirst modern case plant – construction starts in the second half of 2026; commissioning by 2028. AP8 P1 (Taina)CoWoSCapacity increase to > 40,000 units/month by year‑end. AP7 P1 (Chii)WMCM, serves Apple. AP6 (Zhongnan)SoICMonthly capacity 10,000 units.

CoPoS technology
- R&D: equipment installation starts Q3 2026; one year for pilot line construction.
- Pilot line: equipment deliveries by Q2 2028, testing and refinement – about a year.
- Mass production: equipment orders to be placed by mid‑2029; deliveries in Q1 2030; finished products likely in Q4 2030.

CoWoP project (Nvidia + SPIL)
- Joint work with Nvidia and Siliconware Precision Industries.
- Delays possible due to high technical complexity and cost.
- Taiwanese PCB manufacturers show low interest; the project is mainly supported by Chinese companies.

Conclusion: TSMC is actively expanding production, introducing new 3‑nm sites in Taiwan and abroad, and planning a shift to more advanced nodes (2 nm and below). Simultaneously, the company is developing case and packaging lines, including CoWoS and CoPoS, with expected launches between 2027 and 2030.