TSMC plans to increase production in the United States to 12 plants, including four companies for chip packaging and an R&D center.

TSMC plans large-scale expansion of production in Arizona

The Taiwanese company TSMC is considering increasing its semiconductor complex near Phoenix to 12 fabs, four advanced chip packaging facilities, and at least one research and development center. If approved, the plan could become part of a major investment program by Taiwanese companies in the United States, totaling about $500 billion.

What exactly changes
MetricCurrent statePlanned changeNumber of fabs (Fab)6 Fab 21 modules to 12 (including a new Gigafab next to Fab 21)Chip packaging facilities2 to 4R&D centers1 at least 1

TSMC has not officially confirmed these figures, but the company recently purchased about 364 hectares (900 acres) of land adjacent to its existing 445‑hectare (1,100‑acre) site.

Already planned expansion
The current plan includes:

- 6 Fab 21 modules,
- 2 advanced chip packaging facilities,
- 1 research and development center.

Initially the project listed three Fab 21 modules, but in the latest version they were replaced with larger volumes. The need for additional land last fall confirms the company’s intent to continue expanding capacity.

Cost estimate
Industry estimates put a modern module for producing logic chips at a 2‑nm process with a throughput of about 20,000 wafers per month at $25–35 billion.

Doubling the number of modules from 6 to 12 over the next 5–10 years, especially if moving to more advanced processes (1.4 nm and below), will require significantly more than $100 billion compared to what has been stated.

Conclusion
TSMC has strategic reasons for further growth in the United States, but the final configuration of the new expansion is not yet confirmed. The project is expected to become part of a broader initiative of Taiwanese investment in high‑technology sectors in the U.S., but actual figures and timelines remain uncertain.