TSMC plans to open a factory for 3-nanometer microchips in Japan by 2028

TSMC plans to launch 3‑nm chip production in Japan through JASM

In early February it became known that TSMC intends to establish the manufacturing of 3‑nanometer chips on Japanese territory using its joint venture – Japan Advanced Semiconductor Manufacturing (JASM).

* Launch timelines

- For 4‑nm chip production, the company had planned to start operations in Japan by the end of 2027.

- Moving to the finer 3‑nm process pushes those dates to 2028, as reported by Reuters.

* Confirmation of plans

- Clarifications were confirmed after TSMC submitted an official request in Taiwan. Any projects involving the export of high‑technology products from the island require approval from local authorities, and this statement became a key step in the approval process.

* Technical details

- The new facility will be located at JASM’s second plant, which is currently under construction.

- Once operational, the site will be able to process up to 15,000 300‑mm silicon wafers per month using 3‑nm chips.

* Financial aspect

- It is expected that building the second site will require investments of up to USD 17 billion. At the time of publication, official figures were not yet available, but it is anticipated that Japanese authorities will offer subsidies to cover part of the costs.

- Combined with the already operating first JASM plant, total support from Japan could reach a record level of USD 7.9 billion.

* Strategic context

- The Japanese company Rapidus plans to develop chips not only at 2‑nm but also more advanced 1.4‑nm nodes. Therefore, TSMC’s expansion in this direction must align with the country’s national priorities.

Thus, TSMC intends to broaden its technological base in Japan by introducing finer chip manufacturing processes, but this will require significant investment and support from Japanese authorities.